Tortai has passed ISO9001 quality management system, ISO13485 medical device quality management system certification, IATF16949 quality management system for the automotive industry, ISO14001 environmental management system, has a strong engineering quality management team and a professional electronic components procurement team, the products comply with IPC-A-600 & IPC-A-610 standards. Our products comply with IPC-A-600 & IPC-A-610 standards, so that the quality and production technology of all our products are in line with international standards and customers’ requirements. We provide value-added services to satisfy our customers, such as manufacturability check (DFM/DFA), and help our customers successfully complete the rapid transition from design to mass production as a one-stop PCB service provider.
PCBA Production Process Flow
01–Material Procurement
02–Receiving/Storage
03–Feed Inspection
04–Warehousing And Issuance of Materials
05–Material Baking
06–Brush Solder Paste
07–Solder Paste Inspection (SPI)
08–High Speed YAMAHA SMT Machine
09–First Article Inspection (FAI)
10–Reflow Solder
11–Auto Optical Inspection （AOI）for
12–X-Ray Testing
13–FQC Inspection
14–IPQC Patrol Inspection
15–OQC Inspection
16–Pre-Processing
17–Manual Plug-In
18– AOI for DIP
19– DIP Wave Soldering
20–Post-Furnace Pick-up Jig
21– In-Circuit Test (ICT)
22– Dividing Board
23– Panel Cleaning
24–Programming
25–Function Testing
26–First Article Inspection (FAI)
27–Conformal Coating
28–Box Build Assembly
29–Finished Product Function Test
30–OQC Inspection Before Storage
31–Packaging
32–Put Into Storage
33–Deliver From Godown
SMT Workshop Error Proofing System
1.MES Management System:
(1) Automated production plan development and issuance.
(2) Monitoring of the product production process, including production process parameters, equipment status, personnel operations, etc.;
(3) product quality management;
(4) material management;
(5) Inventory management
(6) Finished goods warehousing management.
2.Solder Paste Inspection (SPI)
3D Solder Paste Inspection (SPI) is a technology used for soldering process control in the electronics manufacturing industry. By using optical or laser scanning technology, it can quickly and accurately detect the quality and accuracy of solder paste during the soldering process.
3.Auto Optical Inspection （AOI）for SMT
(AOI ) Automatic Optical Inspection is an advanced technological device mainly used for quality inspection of circuit boards and assemblies in the electronics manufacturing industry. It can quickly and accurately detect defects, errors and anomalies on circuit boards by using optical technology and image processing algorithms.
4.First Article Inspection (FAI)
FAI First Article Inspection is the process of first article inspection of PCBA (Printed Circuit Board Assembly). In the PCBA manufacturing process, first article inspection is a key quality control step to verify that the first article of a new product or process meets the design requirements and specifications.
5.In-Circuit Test (ICT)
In-Circuit Test (ICT) test is a commonly used electrical test method to verify the correctness of the circuit connections on the PCBA and whether the electrical performance meets the requirements.ICT test is usually carried out in the final stage of PCBA manufacturing to ensure the quality and reliability of the PCBA.
6.X-Ray Testing
X-Ray Testing is a non-destructive test method used to check the quality of soldering and assembly inside a PCBA. By using X-ray technology, details such as solder joints, pads, component locations and connectivity inside the PCBA can be viewed to detect possible defects and problems.
7.PCBA Function Testing
PCBA (Printed Circuit Board Assembly) functional test is a series of tests on the assembled circuit board, designed to verify that the various components and functions on the circuit board work properly.
8.AOI for DIP
DIP Insert AOI Inspection is a method of inspecting the quality of DIP Inserts using an Automated Optical Inspection (AOI) system.DIP Inserts are a commonly used form of electronic component packaging, and DIP Insert AOI Inspection can be used to achieve the correctness and quality of the DIP Inserts on a Printed Circuit Board (PCB).
9.PCBA Programme Burning
PCBA programme burning is the process of loading pre-written programme code into a microcontroller or memory on a PCBA (Printed Circuit Board Assembly).
10.PCBA Electric Performance Testing
PCBA Electrical Performance Testing is the process of evaluating and verifying the overall electrical performance of a circuit board after assembly. It aims to ensure that the PCBA can work properly in actual use and meet the design and specification requirements.
11.PCBA Aging Test
PCBA Aging Test is the process of evaluating and verifying the reliability of PCBAs under prolonged use and environmental changes. It aims to simulate the aging of PCBA in actual use to determine whether it can maintain stable and reliable performance in long-term operation.