FR-4-PCB

A PCB Contract Electronics Manufacturer with PCB DesignCapabilities

Rigid Circuit Board(1)
Rigid Circuit Board
Flexible PCB (2)
Flexible PCB
Rigid-Flex-PCB
Rigid-Flex-PCB
3 Products Found.

As practitioners in the electronic manufacturing industry, we know that PCBs occupy an important position in electronic products. A high-quality PCB can not only ensure circuit stability and connectivity, but also improve the reliability and service life of the entire electronic product. Therefore, it is very important to choose a reliable PCB manufacturer.

At TORTAI, we have a wealth of PCB manufacturing experience and professional production equipment, and can provide you with all types of PCB manufacturing services. Whether it is a single panel, double panel or multi-layer panel, we can customize the production according to the needs of customers, so that every PCB can be perfectly matched to your electronic products.

We pay attention to quality control, adopt advanced testing equipment and strict testing processes, and carry out comprehensive testing on every PCB to ensure that it meets international standards and customer requirements. At the same time, we also focus on environmental protection and sustainable development, and all waste is properly disposed of to minimize the impact on the environment.

As a PCB manufacturer with many years of manufacturing experience, we are well aware of the problems encountered by customers in the manufacturing process and actively solve them. Our customer service team will provide you with full tracking service after you place your order to ensure that your order can be delivered on time.

In short, TORTAI is committed to providing customers with high quality, reliable and customized PCB manufacturing services. If you are looking for a suitable PCB manufacturer, please feel free to contact us and let us help you achieve the precision process and high quality requirements of your electronic products.

PCB Process Capability

Item Manufacturer Capability
Layer 1-32 Layers
Material Type FR4, High-TG,Halogen Free, Rogers, Aluminum Base
Max. Panel Dimension 646*1200mm
Outline Tolerance ±0.1mm
Board Thickness 0.25mm-7mm
Board Thickness Tolerance ±10%
Dielectric Thickness 0.075mm-2mm
Min. Track Width 0.075mm
Min. Track Space 0.075mm
External Cu Thickness 18um-210um(HOZ-6OZ)
Internal Cu Thickness 18um-210um(HOZ-6OZ)
Drilling Bit Size 0.15-6.5mm
Finished Hole Dimension 0.1-6mm
Hole Tolerance ±0.05mm
Hole Position Tolerance ±0.05mm
Laser Drilling Hole Size 0.075mm
Aspect Ration 10:01
Solder Mask Green, Blue, White, Black, Red, Yellow, Purple, Ect
Min. Solder Mask Bridge 0.050mm
Plugged Hole Diameter 0.2mm-0.5mm
Impedance Control ±10%
Surface Fishing ​HASL, HASL(lead free), Immersion Gold/Tin/Silver, OSP, Hard Gold
Item Manufacturer Capability
Product type (Single, Double/multilayer) high-density multilayer board, RF antenna board
HDI Technology 2+N+2
Layer Flex: 1-12L
Finished board size Min: 10*10mm; Max: 250*650mm
Board thickness (Min-Max) 0.08mm-3.0mm
Finished product thickness tolerance ±0.03mm
Copper foil thickness (Min-Max) 1/3oz-4oz
Insulation thickness (Min-Max) 0.06-3.0mm
CNC drill hole diameter (Min) 0.2mm
Laser drill nozzle aperture (Min) 0.1mm
Aperture tolerance (PTH) ±0.075mm
Tolerance of drilling hole diameter(NPTH) ±0.05mm
PTH Hole Wall Copper Thickness ≥0.01mm
Line Width/Spacing (Min) 0.05mm/0.05mm(1/3oz Copper foil)
Pad design (Min) 0.23mm
Gold finger width/spacing (Min) 0.05mm/0..05mm
BGA pad (Min) 0.23mm
Minimum center distance between BGA pads 0.5mm
Punching hole diameter tolerance ±0.05mm
Via hole and via hole spacing ≥0.1mm
Minimum distance from line to board edge 0.1mm (Laser)
Minimum character Character height 0.8mm/Word width0.13mm
Thermosetting white oil overprint tolerance ±0.2mm
Etching tolerance ±5%
Surface Finishing ENIG, Electric nickel gold, OSP, HAL LF, Immersion Sliver, Immersion Tin
Punching shape tolerance (laser cutting) ±0.05mm
Punching shape tolerance (slow-moving wire steel die) ±0.05mm
Punching shape tolerance (fast-moving wire steel die) ±0.1mm
Finished board impedance control ±10%
Material PI, Panasonic, DuPont, Stiffener
Item Manufacturer Capability
Product type (Single, Double/multilayer) high-density multilayer board, Rigid-Flex board, RF antenna board
HDI Technology 2+N+2
Layer Rigid+flex: 2-20L
Finished board size Min: 10*10mm; Max: 250*650mm
Board thickness (Min-Max) 0.08mm-3.0mm
Finished product thickness tolerance ±0.03mm
Copper foil thickness (Min-Max) 1/3oz-4oz
Insulation thickness (Min-Max) 0.06-3.0mm
CNC drill hole diameter (Min) 0.2mm
Laser drill nozzle aperture (Min) 0.1mm
Aperture tolerance (PTH) ±0.075mm
Tolerance of drilling hole diameter(NPTH) ±0.05mm
PTH Hole Wall Copper Thickness ≥0.01mm
Line Width/Spacing (Min) 0.05mm/0.05mm(1/3oz Copper foil)
Pad design (Min) 0.23mm
Gold finger width/spacing (Min) 0.05mm/0..05mm
BGA pad (Min) 0.23mm
Minimum center distance between BGA pads 0.5mm
Punching hole diameter tolerance ±0.05mm
Via hole and via hole spacing ≥0.1mm
Minimum distance from line to board edge 0.1mm (Laser)
Minimum character Character height 0.8mm/Word width0.13mm
Thermosetting white oil overprint tolerance ±0.2mm
Etching tolerance ±5%
Surface Finishing ENIG, Electric nickel gold, OSP, HAL LF, Immersion Sliver, Immersion Tin
Punching shape tolerance (laser cutting) ±0.05mm
Punching shape tolerance (slow-moving wire steel die) ±0.05mm
Punching shape tolerance (fast-moving wire steel die) ±0.1mm
Finished board impedance control ±10%
Material PI, Panasonic, DuPont, Stiffener

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