A PCB Contract Electronics Manufacturer with PCB DesignCapabilities
As practitioners in the electronic manufacturing industry, we know that PCBs occupy an important position in electronic products. A high-quality PCB can not only ensure circuit stability and connectivity, but also improve the reliability and service life of the entire electronic product. Therefore, it is very important to choose a reliable PCB manufacturer.
At TORTAI, we have a wealth of PCB manufacturing experience and professional production equipment, and can provide you with all types of PCB manufacturing services. Whether it is a single panel, double panel or multi-layer panel, we can customize the production according to the needs of customers, so that every PCB can be perfectly matched to your electronic products.
We pay attention to quality control, adopt advanced testing equipment and strict testing processes, and carry out comprehensive testing on every PCB to ensure that it meets international standards and customer requirements. At the same time, we also focus on environmental protection and sustainable development, and all waste is properly disposed of to minimize the impact on the environment.
As a PCB manufacturer with many years of manufacturing experience, we are well aware of the problems encountered by customers in the manufacturing process and actively solve them. Our customer service team will provide you with full tracking service after you place your order to ensure that your order can be delivered on time.
In short, TORTAI is committed to providing customers with high quality, reliable and customized PCB manufacturing services. If you are looking for a suitable PCB manufacturer, please feel free to contact us and let us help you achieve the precision process and high quality requirements of your electronic products.
PCB Process Capability
- Rigid circuit Board
- Flexible PCB
- Rigid-flex-PCB
Item | Manufacturer Capability |
Layer | 1-32 Layers |
Material Type | FR4, High-TG,Halogen Free, Rogers, Aluminum Base |
Max. Panel Dimension | 646*1200mm |
Outline Tolerance | ±0.1mm |
Board Thickness | 0.25mm-7mm |
Board Thickness Tolerance | ±10% |
Dielectric Thickness | 0.075mm-2mm |
Min. Track Width | 0.075mm |
Min. Track Space | 0.075mm |
External Cu Thickness | 18um-210um(HOZ-6OZ) |
Internal Cu Thickness | 18um-210um(HOZ-6OZ) |
Drilling Bit Size | 0.15-6.5mm |
Finished Hole Dimension | 0.1-6mm |
Hole Tolerance | ±0.05mm |
Hole Position Tolerance | ±0.05mm |
Laser Drilling Hole Size | 0.075mm |
Aspect Ration | 10:01 |
Solder Mask | Green, Blue, White, Black, Red, Yellow, Purple, Ect |
Min. Solder Mask Bridge | 0.050mm |
Plugged Hole Diameter | 0.2mm-0.5mm |
Impedance Control | ±10% |
Surface Fishing | HASL, HASL(lead free), Immersion Gold/Tin/Silver, OSP, Hard Gold |
Item | Manufacturer Capability |
Product type | (Single, Double/multilayer) high-density multilayer board, RF antenna board |
HDI Technology | 2+N+2 |
Layer | Flex: 1-12L |
Finished board size | Min: 10*10mm; Max: 250*650mm |
Board thickness (Min-Max) | 0.08mm-3.0mm |
Finished product thickness tolerance | ±0.03mm |
Copper foil thickness (Min-Max) | 1/3oz-4oz |
Insulation thickness (Min-Max) | 0.06-3.0mm |
CNC drill hole diameter (Min) | 0.2mm |
Laser drill nozzle aperture (Min) | 0.1mm |
Aperture tolerance (PTH) | ±0.075mm |
Tolerance of drilling hole diameter(NPTH) | ±0.05mm |
PTH Hole Wall Copper Thickness | ≥0.01mm |
Line Width/Spacing (Min) | 0.05mm/0.05mm(1/3oz Copper foil) |
Pad design (Min) | 0.23mm |
Gold finger width/spacing (Min) | 0.05mm/0..05mm |
BGA pad (Min) | 0.23mm |
Minimum center distance between BGA pads | 0.5mm |
Punching hole diameter tolerance | ±0.05mm |
Via hole and via hole spacing | ≥0.1mm |
Minimum distance from line to board edge | 0.1mm (Laser) |
Minimum character | Character height 0.8mm/Word width0.13mm |
Thermosetting white oil overprint tolerance | ±0.2mm |
Etching tolerance | ±5% |
Surface Finishing | ENIG, Electric nickel gold, OSP, HAL LF, Immersion Sliver, Immersion Tin |
Punching shape tolerance (laser cutting) | ±0.05mm |
Punching shape tolerance (slow-moving wire steel die) | ±0.05mm |
Punching shape tolerance (fast-moving wire steel die) | ±0.1mm |
Finished board impedance control | ±10% |
Material | PI, Panasonic, DuPont, Stiffener |
Item | Manufacturer Capability |
Product type | (Single, Double/multilayer) high-density multilayer board, Rigid-Flex board, RF antenna board |
HDI Technology | 2+N+2 |
Layer | Rigid+flex: 2-20L |
Finished board size | Min: 10*10mm; Max: 250*650mm |
Board thickness (Min-Max) | 0.08mm-3.0mm |
Finished product thickness tolerance | ±0.03mm |
Copper foil thickness (Min-Max) | 1/3oz-4oz |
Insulation thickness (Min-Max) | 0.06-3.0mm |
CNC drill hole diameter (Min) | 0.2mm |
Laser drill nozzle aperture (Min) | 0.1mm |
Aperture tolerance (PTH) | ±0.075mm |
Tolerance of drilling hole diameter(NPTH) | ±0.05mm |
PTH Hole Wall Copper Thickness | ≥0.01mm |
Line Width/Spacing (Min) | 0.05mm/0.05mm(1/3oz Copper foil) |
Pad design (Min) | 0.23mm |
Gold finger width/spacing (Min) | 0.05mm/0..05mm |
BGA pad (Min) | 0.23mm |
Minimum center distance between BGA pads | 0.5mm |
Punching hole diameter tolerance | ±0.05mm |
Via hole and via hole spacing | ≥0.1mm |
Minimum distance from line to board edge | 0.1mm (Laser) |
Minimum character | Character height 0.8mm/Word width0.13mm |
Thermosetting white oil overprint tolerance | ±0.2mm |
Etching tolerance | ±5% |
Surface Finishing | ENIG, Electric nickel gold, OSP, HAL LF, Immersion Sliver, Immersion Tin |
Punching shape tolerance (laser cutting) | ±0.05mm |
Punching shape tolerance (slow-moving wire steel die) | ±0.05mm |
Punching shape tolerance (fast-moving wire steel die) | ±0.1mm |
Finished board impedance control | ±10% |
Material | PI, Panasonic, DuPont, Stiffener |