A PCB Contract Electronics Manufacturer with PCB Design Capabilities
Rigid Circuit Board
Flexible PCB
Rigid-Flex-PCB
3 Products Found.
PCB Types and Applications
| Single and surface mount | Designs to support thru hole and surface mount. Normally used in automotive industry. |
| Double-sided PCB | Mixed technology circuitry supporting SMT and thru hole. |
| Aluminum Clad PCB | Typically use thermal dielectric materials bonded to an aluminum core for highly efficient dissipation of heat to cool components and increase the overall performance of products. LED PCBs are the most common usage. |
| Multilayer PCB | Up to 32 layer PCBs for High speed advanced designs. |
| HDI PCB | High Density Interconnect using laser drilled microvias up to 4-N-4 |
| Back Panel PCB | Larger and thicker than normal PCBs often with press fit connectors. Used in Telecommunications as backbone interconnections. |
| Flexible PCB | Usually made using polymide (Kapton) materials, these are single, double and multilayer(upto8 layers) PCB. |
| Semi Flex PCB | Rigid PCBs with bend areas milled down to make it very thin. They are meant to be bent on installation and not flex afterwards. A much cheaper alternative to PI flex and rigid flex. |
| Rigid Flex | Hybrid of Rigid and flex PCBs. The rigid portions are connected by flex imbedded in the inner layers. Although more expensive than rigid PCBs connected by flexible cables, connectors and discrete wiring, they have higher reliability connections. |
| Heavy Copper | Rigid PCBs, uses upto 12oz copper layers. Typically used in high power transmission applications. |
| Thermal PCB | Aluminium PCBs and embedded copper layers for highly efficient dissipation of heat to cool components and increase the overall performance of devices. |
| RF / Microwave PCB | Applications that typically require laminates with specialized electrical, thermal, mechanical, or other performance characteristics that exceed those of traditional standard FR-4. Used for signals that are 5 GHz and higher. Typically using PTFE (Teflon) materials. |
PCB Surface and Finishes
| Immersion Silver (ImAg) | Immersion Silver is a good alternative to Electroless Nickel/ Immersion Gold (ENIG) for fine pitch applications due to the lower cost. This finish is becoming a standard in the industry and works well in lead-free processing. Surface preparation is available in polish or etch, it is important to note that polish should be used for micro technology and etch for all others. NOTE: This finish is not backwards compatible with leaded processing and should NOT be selected for applications which will switch between leaded and lead-free. |
| Electroless Nickel/ Immersion Gold (ENIG) | ENIG is a long proven industry standard and is readily available from most PCB fabricators. This finish is suitable for almost any lead-free application regardless of complexity; however is the highest cost finish. This finish is backwards compatible with both leaded and lead-free processing. |
| Organic Solderability Preservatives (OSP) | OSP is one of the PCB surface finishes, means Organic Solderability Preservatives, which is applied upon the bare copper to prevent PCB from being oxidized. OSP is RoHS compliant and can be quickly removed in the PCB assembly processing. |
| Immersion Tin | Immersion tin is a lead-free surface finish, which is excellent for small components. It is very thin and flat; it is perfect for Fine Pitch Technology (FTP). |
| Hot Air Solder Leveling (HASL) | Hot air solder leveling (HASL) is a widely used PCB surface finish. It is inexpensive and easily available. It also offers a high solderability finish, making it a dominant player in the market for several years. Due to the RoHS directive, there is a major transition from HASL to lead-free HASL. |
| Flash Gold | Soft gold PCB surface finish that is very well suited to wire bonding operations. The soft gold used in this process can easily form strong metallic bonds with standard copper traces and wires. The strong bond of gold and copper allows for more conductive connections when leads are soldered to the board during the PCB Assembly Process. |
| Palladium | ENEPIG is the best surface finish that resists corrosion and reaction with air. It has a longer shelf life, which makes it the best of all. |
| Hard Gold | Plated Gold surface finish is also known as Hard Gold surface finish. It’s an expensive surface finish that uses a layer of gold on the PCB. It’s done through electroplating, and a hard layer of gold is attached to the surface of the copper. The adhesion between the PCB and the layer is firm, which increases the durability of the board. |
| Soft Gold | Soft gold PCB surface finish that is very well suited to wire bonding operations. The soft gold used in this process can easily form strong metallic bonds with standard copper traces and wires. |
Pre-production Engineering
| DFF | Design for Fabrication (DFF) is intended to help review customers’ designs with respect to PCB manufacturability as early in the design cycle as possible. |
| Schematics | electrical diagram of the PCB Board. |
| DFM review | Design for Manufacturing to improve yields in the assembly process. |
| PCB Stackup | Increase the density by using smaller components to reduce overall size of the PCB |
| Impedance Analysis | Controlling the time it takes for signals to get from one point to another by controlling line with and distance to a copper plane layer. |
As practitioners in the electronic manufacturing industry, we know that PCBs occupy an important position in electronic products. A high-quality PCB can not only ensure circuit stability and connectivity, but also improve the reliability and service life of the entire electronic product. Therefore, it is very important to choose a reliable PCB manufacturer.
At TORTAI, we have a wealth of PCB manufacturing experience and professional production equipment, and can provide you with all types of PCB manufacturing services. Whether it is a single panel, double panel or multi-layer panel, we can customize the production according to the needs of customers, so that every PCB can be perfectly matched to your electronic products.
We pay attention to quality control, adopt advanced testing equipment and strict testing processes, and carry out comprehensive testing on every PCB to ensure that it meets international standards and customer requirements. At the same time, we also focus on environmental protection and sustainable development, and all waste is properly disposed of to minimize the impact on the environment.
As a PCB manufacturer with many years of manufacturing experience, we are well aware of the problems encountered by customers in the manufacturing process and actively solve them. Our customer service team will provide you with full tracking service after you place your order to ensure that your order can be delivered on time.
In short, TORTAI is committed to providing customers with high quality, reliable and customized PCB manufacturing services. If you are looking for a suitable PCB manufacturer, please feel free to contact us and let us help you achieve the precision process and high quality requirements of your electronic products.
PCB Process Capability
- Rigid circuit Board
- Flexible PCB
- Rigid-flex-PCB
| Item | Manufacturer Capability |
| Layer | 1-32 Layers |
| Material Type | FR4, High-TG,Halogen Free, Rogers, Aluminum Base |
| Max. Panel Dimension | 646*1200mm |
| Outline Tolerance | ±0.1mm |
| Board Thickness | 0.25mm-7mm |
| Board Thickness Tolerance | ±10% |
| Dielectric Thickness | 0.075mm-2mm |
| Min. Track Width | 0.075mm |
| Min. Track Space | 0.075mm |
| External Cu Thickness | 18um-210um(HOZ-6OZ) |
| Internal Cu Thickness | 18um-210um(HOZ-6OZ) |
| Drilling Bit Size | 0.15-6.5mm |
| Finished Hole Dimension | 0.1-6mm |
| Hole Tolerance | ±0.05mm |
| Hole Position Tolerance | ±0.05mm |
| Laser Drilling Hole Size | 0.075mm |
| Aspect Ration | 10:01 |
| Solder Mask | Green, Blue, White, Black, Red, Yellow, Purple, Ect |
| Min. Solder Mask Bridge | 0.050mm |
| Plugged Hole Diameter | 0.2mm-0.5mm |
| Impedance Control | ±10% |
| Surface Fishing | HASL, HASL(lead free), Immersion Gold/Tin/Silver, OSP, Hard Gold |
| Item | Manufacturer Capability |
| Product type | (Single, Double/multilayer) high-density multilayer board, RF antenna board |
| HDI Technology | 2+N+2 |
| Layer | Flex: 1-12L |
| Finished board size | Min: 10*10mm; Max: 250*650mm |
| Board thickness (Min-Max) | 0.08mm-3.0mm |
| Finished product thickness tolerance | ±0.03mm |
| Copper foil thickness (Min-Max) | 1/3oz-4oz |
| Insulation thickness (Min-Max) | 0.06-3.0mm |
| CNC drill hole diameter (Min) | 0.2mm |
| Laser drill nozzle aperture (Min) | 0.1mm |
| Aperture tolerance (PTH) | ±0.075mm |
| Tolerance of drilling hole diameter(NPTH) | ±0.05mm |
| PTH Hole Wall Copper Thickness | ≥0.01mm |
| Line Width/Spacing (Min) | 0.05mm/0.05mm(1/3oz Copper foil) |
| Pad design (Min) | 0.23mm |
| Gold finger width/spacing (Min) | 0.05mm/0..05mm |
| BGA pad (Min) | 0.23mm |
| Minimum center distance between BGA pads | 0.5mm |
| Punching hole diameter tolerance | ±0.05mm |
| Via hole and via hole spacing | ≥0.1mm |
| Minimum distance from line to board edge | 0.1mm (Laser) |
| Minimum character | Character height 0.8mm/Word width0.13mm |
| Thermosetting white oil overprint tolerance | ±0.2mm |
| Etching tolerance | ±5% |
| Surface Finishing | ENIG, Electric nickel gold, OSP, HAL LF, Immersion Sliver, Immersion Tin |
| Punching shape tolerance (laser cutting) | ±0.05mm |
| Punching shape tolerance (slow-moving wire steel die) | ±0.05mm |
| Punching shape tolerance (fast-moving wire steel die) | ±0.1mm |
| Finished board impedance control | ±10% |
| Material | PI, Panasonic, DuPont, Stiffener |
| Item | Manufacturer Capability |
| Product type | (Single, Double/multilayer) high-density multilayer board, Rigid-Flex board, RF antenna board |
| HDI Technology | 2+N+2 |
| Layer | Rigid+flex: 2-20L |
| Finished board size | Min: 10*10mm; Max: 250*650mm |
| Board thickness (Min-Max) | 0.08mm-3.0mm |
| Finished product thickness tolerance | ±0.03mm |
| Copper foil thickness (Min-Max) | 1/3oz-4oz |
| Insulation thickness (Min-Max) | 0.06-3.0mm |
| CNC drill hole diameter (Min) | 0.2mm |
| Laser drill nozzle aperture (Min) | 0.1mm |
| Aperture tolerance (PTH) | ±0.075mm |
| Tolerance of drilling hole diameter(NPTH) | ±0.05mm |
| PTH Hole Wall Copper Thickness | ≥0.01mm |
| Line Width/Spacing (Min) | 0.05mm/0.05mm(1/3oz Copper foil) |
| Pad design (Min) | 0.23mm |
| Gold finger width/spacing (Min) | 0.05mm/0..05mm |
| BGA pad (Min) | 0.23mm |
| Minimum center distance between BGA pads | 0.5mm |
| Punching hole diameter tolerance | ±0.05mm |
| Via hole and via hole spacing | ≥0.1mm |
| Minimum distance from line to board edge | 0.1mm (Laser) |
| Minimum character | Character height 0.8mm/Word width0.13mm |
| Thermosetting white oil overprint tolerance | ±0.2mm |
| Etching tolerance | ±5% |
| Surface Finishing | ENIG, Electric nickel gold, OSP, HAL LF, Immersion Sliver, Immersion Tin |
| Punching shape tolerance (laser cutting) | ±0.05mm |
| Punching shape tolerance (slow-moving wire steel die) | ±0.05mm |
| Punching shape tolerance (fast-moving wire steel die) | ±0.1mm |
| Finished board impedance control | ±10% |
| Material | PI, Panasonic, DuPont, Stiffener |